XPER modules provide emulation possibilities for on-chip peripherals which are not included on the C167-bondout used on the DProbe167. The so-called "two-chip-emulation" enhances the functionality of the bondout chip by connecting a standard derivative to the XPER bus.

This technology guarantees the expandabilty of the DProbe167 for future derivatives. The cost for supporting a new device is reduced and rapid availability is ensured.

To decide whether an XPER module is necessary to fully emulate your derivative, please refer to the list of supported derivatives.