XPER modules provide emulation possibilities for on-chip peripherals which are not included on the ST201-bondout used in the DProbeST10. The so-called "two-chip-emulation" enhances functionality of the bondout chip by connecting a standard derivative to the XPER bus.

This technology guarantees expansion of the DProbeST10 for future derivatives. The cost for supporting a new device is therefore reduced and rapid availability is ensured.

To decide whether an XPER module is necessary to fully emulate your derivative, please refer to the list of supported derivatives.